Modeling Macro-Sized, High Aspect Ratio Through-Hole Filling by Multi-Component Additive-Assisted Copper Electrodeposition
نویسندگان
چکیده
منابع مشابه
Aspect-Ratio-Dependent Copper Electrodeposition Technique for Very High Aspect-Ratio Through-Hole Plating
Copper electrodeposition in high-aspect-ratio through-holes micromachined by deep reactive ion etching is one of the most essential processes for fabricating through-wafer interconnects, which will be used in developing future generation high-speed, compact 3D microelectronic devices. Although copper electrodeposition is a well-established process, completely void-free electroplating in very de...
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ژورنال
عنوان ژورنال: Journal of The Electrochemical Society
سال: 2013
ISSN: 0013-4651,1945-7111
DOI: 10.1149/2.018312jes